From facility-scale CDUs to rack-level direct-to-chip manifolds — every system engineered for sustained 100+ kW rack density.
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Dry coolers are the product BITSINK pioneered — rejecting heat outdoors with zero water consumption, across seven tiers spanning a single-fan standalone unit up to an 18-fan V-frame bank. The backbone of over 220 MW of deployed GPU/ASIC compute capacity worldwide.
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Mechanical chiller systems supporting liquid cooling loops and air handling across BITSINK deployments — for sites where mechanical cooling is required alongside or instead of dry cooling.
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Integrated rear-door air-to-water cooling enclosure — 50–100 kW (water), plug-and-play, compatible with standard 19 in EIA-310-D server racks. Rear-door, swing-open access for quick rack service without disturbing IT hardware.
Coming Soon
We're finalizing the CDU Rack for hyperscale liquid-cooled halls. Full specifications and datasheets will be published here as soon as they're ready.
Coming Soon
We're finalizing the Direct-to-Chip Manifold for rack-level coolant distribution to cold plates. Full specifications and datasheets will be published here as soon as they're ready.
Coming Soon
We're finalizing the N+1 Pump Skid for redundant coolant circulation in liquid-cooled halls. Full specifications and datasheets will be published here as soon as they're ready.